摘 要:
With the rapid development of Micro-Electro-Mechanical System (MEMS), we enter a field in which the surface effects have dominated many of the micro-scale phenomena, and the adhesive contact is one of the focuses. In this paper, a feasible model for finite element computation is presented via a macroscopic and microscopic combination approach, in which the adhesive forces are simulated by some non-linear spring elements considering the softening stage. Two basic problems concerning the adhesion effect were considered; through specific quantitative analysis, the results show a consistency with the current elastic continuum theories of adhesion and a brief investigation into the effects of adhesion on plastic deformation and tangential contact will be carried out as well. (共7页)
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