文献信息
电子封装陶瓷制品聚酰亚胺电介体低温共烧陶瓷倒装芯片塑料球栅阵列封装多芯片组件塑料外包装高解像度已知良好芯片厚胶片衬底基片无源组件倒装焊技术MCM基板底部填充剂面阵列封装焊料接头塑封球栅阵列封装
无数据
vol.25 (2005)
vol.22 (1999)
vol.21 (1998)
vol.20 (1997)
vol.19 (1996)
vol.18 (1995)
vol.17 (1994)
vol.16 (1993)
vol.10 (1987)
vol.9 (1986)
vol.8 (1985)
vol.7 (1984)
vol.6 (1983)
vol.5 (1982)
Murphy, Cynthia F.
Nowak, MattNelson, JohnGwinn, OrvalWing, Ruth
Kondoh, YouUeno, Toshiaki
Gengel, Glenn
Carey, DavidHashemi, HassanHunter, Paul
Martinez, MarceloGibson, DavidMatthew, LindaDiStefano, ThomasCofield, John
Adema, Gretchen M.Berry, Christopher J.Koopman, Nicholas G.Rinne, Glenn A.Yung, Edward K.Turlik, Iwona
Dudderar, T.D.Degani, Y.Spadafora, J.G.Tai, K.L.Frye, R.C.
Minehan, W.T.Weidner, W.K.Jensen, R.J.Spielberger, R.K.Jacobsen, W.F.
Amerson, RickKuekes, Phil
Peterson, David W.Sweet, James N.Johnson, Don R.Andaleon, David D.Renzi, Ronald F.
Fillion, R.A.Wojnarowski, R.J.Bicknell, W.H.Daum, W.Forman, G.
Oppermann, MartinHoll, BrunoFeurer, Ernst
Harper, Peter R.
1994年4期
客服热线
400-638-5550
客服邮箱
service@cqvip.com