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电子封装陶瓷制品聚酰亚胺电介体低温共烧陶瓷倒装芯片多芯片组件塑料外包装高解像度芯片级封装已知良好芯片厚胶片衬底基片无源组件倒装焊技术MCM基板底部填充剂面阵列封装焊料接头塑封球栅阵列封装
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vol.25 (2005)
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vol.10 (1987)
vol.9 (1986)
vol.8 (1985)
vol.7 (1984)
vol.6 (1983)
vol.5 (1982)
Wagner, Guy R.
Nguyen, My N.Chien, Irving Y.
Hong, Bor ZenYuan, Tsorng-Dih
Cohen, TomPatel, Gautam
Palmskog, G.Arvidsson, G.Eriksen, P.Gustafsson, G.Hagel, O.-J.Hammar, J.Henriksson, P.
Fauty, JosephSauvageau, JosephStrouse, SteveSelby, MarvinMaxwell, MarkSandifer, Mark
Choi, Tong P.Yoo, Choong D.Lee, Tae S.
Park, JongwooGary Harlow, D.
Smith, KyleJohnson II, CaliphSitaraman, Suresh
Liew, H.-L.Yasir, A.Q.Hassan, A.Y.Seetharamu, K.N.
Wang, YinyanHassell, Patrick
Newman, K.E.Keezer, D.C.Davis, J.S.
Shiraishi, TsukasaAmami, KazuyoshiBessho, YoshiriroSakamaoto, KazunoriEda, KazuoIshida, ToruFukuoka, Kazuyoshi
Butler, Jeffrey T.Chu, Patrick B.Bright, Victor M.Saia, Richard J.
Jiang, HuntChou, BillBeilin, Solomon
De Samber, MarcMilsom, RobertPulsford, NickVan Delden, Marc
1998年2期
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