- 充值
- 会员
- 职称材料
文献信息
Conductive AdhesivesElectronic PackagingPackaging TechnologiesRelaxation ModulusFinite Element MethodConductive AdhesivePackage DesignElectronic SystemsTime Temperature Superposition PrincipleIsotropically Conductive AdhesivesRelative HumidityThermally Conductive AdhesivesAnisotropic Conductive AdhesivesIsotropic Conductive AdhesiveDesign Optimization MethodologyFlip-chip InterconnectElectrically Conductive AdhesivesTime-Dependent Dielectric BreakdownJet Array ImpingementSingle-phase Heat Transfer
vol.1 (1998)
vol.1 (1995)