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有限元法计算电子封装系统级封装变速器有限元素先进封装印制电路板加工制造技术倒装芯片多芯片组件同步开关噪声电子产品包装圆片级真空封装包装工艺学衬底基片晶圆片面阵列封装信号完好性焊料接头委员会会员
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vol.33 (2010)
vol.32 (2009)
vol.31 (2008)
vol.30 (2007)
vol.29 (2006)
vol.28 (2005)
vol.27 (2004)
vol.26 (2003)
vol.25 (2002)
vol.24 (2001)
vol.23 (2000)
vol.22 (1999)
Johnson, R. Wayne
Jiao, Dan
Antonini, GiulioRuehli, Albert E.
Wang, RuiJin, Jian-Ming
Jiang, LijunXu, ChuanRubin, Barry J.Weger, Alan J.Deutsch, AlinaSmith, HowardCaron, AlainBanerjee, Kaustav
Han, YoungaeZhao, Jinsong
Chai, WenwenJiao, Dan
Han, Ki JinSwaminathan, MadhavanBandyopadhyay, Tapobrata
El-Moselhy, TarekElfadel, Ibrahim M.Daniel, Luca
Rubin, Barry J.
Tsang, LeungBraunisch, HenningDing, RuihuaGu, Xiaoxiong
Kim, Joong-HoOh, DanKim, Woopoung
Chandrappan, JayakrishnanJing, ZhangJie, Ng RuiDamaruganath, PinjalaLau, John
Wang, FengtaoLiu, FuhanKong, LinghuaSundaram, VenkyTummala, Rao R.Adibi, Ali
Yeo, Sung-KuChun, Jong-HoonKwon, Young-Se
Zhang, RongweiMoon, Kyoung-SikLin, WeiDuan, YiqunLotz, Stefanie M.Wong, C. P.
Liu, JianguoCao, YuWang, XiaoyeDuan, JunZeng, Xiaoyan
Xu, DehuiJing, ErrongXiong, BinWang, Yuelin
Hong, Sung JunJun, Ji HeonJung, Jae PilMayer, MichaelZhou, Y. Norman
Salleras, MarcCarmona, ManuelMarco, Santiago
2010年4期
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