IEEE Letters on Electromagnetic Compatibility Practice and Applications

美国

发文量 204

被引量 1,053

影响因子(2025版) 0.941

IEEE Letters on Electromagnetic Compatibility Practice and Applications (L-EMCPA) is a forum for rapid publication of articles describing practice, lessons learned and applications of the disciplines electromagnetic compatibility (EMC) and signal and power integrity (SIPI) as well as all relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity.

主办单位： IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
出版地区： PISCATAWAY
出版周期：年4期
别名： IEEE LETT ELECTROMAG;IEEE Lett. Electromagn. Compat. Pract.Appl.;IEEE. Lett. EMC. Pract. Applicat.;IEEE LETTERS ON ELECTROMAGNETIC COMPATIBILITY PRACTICE AND APPLICATIONS

创刊时间： 2019年

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出版文献

期刊详情

新发布(2025版)

分析评价

vol.8 (2026)
vol.8 (2026)

2 1
vol.7 (2025)
vol.7 (2025)
vol.6 (2024)
vol.6 (2024)
vol.5 (2023)
vol.5 (2023)
vol.4 (2022)
vol.4 (2022)
vol.3 (2021)
vol.3 (2021)
vol.2 (2020)
vol.2 (2020)
vol.1 (2019)
vol.1 (2019)

封面

2026年2期

共：4篇

Leferink, FrankPokotilov, Denys

39-44
Nishiyama, HikaruFujimoto, DaisukeHayashi, Yuichi

45-50
Su, XiangruiHwang, SuminLiu, YuanzhuoRajagopalan, JaganHwang, Chulsoon

51-55
Giannetti, GiacomoLeder, NorbertWeiler, ThomasSpindelberger, ChristianArthaber, Holger

56-60