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IEEE Transactions on Components, Packaging and Manufacturing Technology
中科院3区 JCR:Q3 JCR:Q2 SCIE EI IEEE PubMed JST
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal.
- 主办单位： IEEE
- 出版地区： PISCATAWAY
- 出版周期： 年12期
- 别名： IEEE T COMP PACK MAN;IEEE TRANS COMPON PACK MANUF;IEEE Trans Compon Packaging Manuf Technol;IEEE Trans. Compon. Pack. Manuf. Technol.;IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY;IEEE Transactions on Components Packaging and Manufacturing Technology;IEEE Transactions on Components, Packaging & Manufacturing Technology;IEEE Transactions on Components, Packaging, and Manufacturing Technology;IEEE transactions on components, packaging, and manufacturing technology;IEEE组件、包装与制造技术汇刊
- 国际标准连续出版物号/电子版： ISSN 2156-3950 / EISSN 2156-3985
- 创刊时间： 2011年
- 曾用名： IEEE transactions on advanced packaging,IEEE transactions on components and packaging technologies,IEEE transactions on electronics packaging manufacturing
期刊信息
- 主办单位：IEEE
- 主 编：Yogendra Joshi
- 地 址： PISCATAWAY
- 电子邮件： yogendra.joshi@me.gatech.edu(Chief Editor,Yogendra Joshi)
期刊简介
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal.