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Journal of Electronic Packaging
中科院4区 JCR:Q3 JCR:Q2 SCIE EI PubMed JST
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
- 主办单位： ASME
- 出版地区： NEW YORK
- 出版周期： 季刊
- 别名： J ELECTRON PACKAGING;J Electron Packag;J. Electron. Packag.;JOURNAL OF ELECTRONIC PACKAGING;Journal of electronic packaging;电子封装期刊
- 国际标准连续出版物号/电子版： ISSN 1043-7398 / EISSN 1528-9044
- 创刊时间： 1989年
期刊信息
- 主办单位：ASME
- 地 址： NEW YORK
期刊简介
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.